Packaging Research and Development Engineer
Core
Develop and scale advanced substrate packaging processes and materials to enable die disaggregation and heterogeneous integration.
Role type
Senior IC packaging R&D engineer (substrate technology)
Builds
Advanced substrate packaging modules for heterogeneous integration
Domain
Semiconductor manufacturing / Materials science
Required skills
DOE design, process capability analysis, cross-functional team leadership, equipment configuration, process flow definition, supplier interaction, ambiguity management
Preferred skills
Engineering troubleshooting, SPC/PCS/RFCs, statistical data analysis, JMP/JSL, Python, relational databases, machine learning, characterization techniques (DSC, TGA, FTIR, SEM, etc.), organic/inorganic material processing
Technologies
JMP, JSL, Python, DSC, TGA, FTIR, XPS, TOFSIMS, EDX, SEM
Responsibilities
Define equipment configurations and process specifications, conduct DOEs to characterize process windows, drive continuous process improvements for yield and reliability, lead cross-functional teams for substrate technology development
Seniority
Senior, hands-on IC
