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Hardware & Physical Engineering
› Semiconductor Process Engineering
Semiconductor Process Engineering
3,460 open positions
Application Engineer, Software Engineering
Amat
Hsinchu,TWN
13d
Lead MES solution design and architecture for semiconductor manufacturing implementations, translating customer processes into scalable systems.
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Sr SMT Process Engineer
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North American Production Sharing
Tijuana, BCN, MX
13d
Lead innovation, process optimization, and continuous improvement in Surface Mount Technology (SMT) manufacturing operations to ensure efficiency, quality, and successful New Product Introduction (NPI).
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Machine Operator Lead
Semtech
USA - Colorado Springs - Federal
$0k–$0k
13d
Direct manufacturing team and operate semiconductor production equipment to meet weekly output goals.
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Module Development Engineer
Intel
US, Oregon, Hillsboro
$134k–$134k
13d
Develop and sustain Chemical Mechanical Planarization (CMP) techniques for diverse materials and architectures to enable rapid miniaturization and mass production of integrated circuits.
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Entwicklungsingenieur für die Prozessentwicklung sensibler Komponenten (m/w/x)
Zeissgroup
Oberkochen
13d
Develop, implement, and document robust processes for the assembly of sensitive components in lithographic exposure optics.
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Packaging Module Development Engineer
Intel
US, Arizona, Phoenix
$134k–$134k
13d
Develop and qualify advanced packaging processes, materials, and equipment for high-volume manufacturing to support Intel's heterogeneous integration and die disaggregation solutions.
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Senior Field Product Readiness Engineer
Amat
Pyeongtaek-Mokok,KOR
13d
Lead service product readiness execution for semiconductor equipment product lines, ensuring successful transition from early readiness through NPI and HVM.
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Process Technician
Nxp
Chandler (Manufacturing)
13d
Monitor process operations, troubleshoot yield problems, and maintain manufacturing quality standards in a semiconductor environment.
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Shift Engineer, Metro Real-time Defect Analysis
Micron
MSB, Singapore
13d
First-line technical responder ensuring stable operation of advanced packaging equipment during New Product Introduction (NPI) and early-life production phases.
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Development Engineer – Adhesive Bonding Process Technology (f/m/x)
Zeissgroup
Oberkochen
13d
Develop adhesive bonding processes and equipment for optomechanical assemblies used in semiconductor industry optics.
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Development Engineer for Field Assembly of Sensitive Components (m/f/x)
Zeissgroup
Oberkochen
13d
Lead end-to-end field integration, commissioning, and validation of lithographic exposure optics assembly for semiconductor manufacturing.
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Advanced Manufacturing Engineer
Apple
Cupertino, United States of America
$235k–$235k
13d
Ensure product design robustness and manufacturability in high volumes by leading engineering teams through the development cycle, managing fixture automation, and driving failure analysis.
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Sr. Module Engineer, Hybrid Bonding
Amat
Santa Clara,CA
$147k–$147k
13d
Develop and scale next-generation die-to-wafer hybrid bonding processes for advanced semiconductor packaging applications including Memory, chiplets, AI accelerators, and heterogeneous integration platforms.
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Wide Bandgap Device/PI Engineer (R&D)
Texas Instruments
Dallas, TX, United States
13d
Leading the development, characterization, and optimization of Gallium Nitride (GaN) power devices for high-volume manufacturing.
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New College Grad - Dry Etch Process Engineer
Micron
Manassas, VA - Fab 6
13d
Develop, optimize, and sustain semiconductor fabrication processes to improve yield, quality, reliability, and manufacturing cost performance.
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MTB PWF MRDA EQUIPMENT ENGINEER(FY28 NCG)
Micron
Taichung - MTB, Taiwan
13d
Install, maintain, and sustain MRDA equipment while establishing process conditions and upgrading tool capabilities for semiconductor manufacturing.
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Advanced Technology Japan Engineer, Dry Etching
Micron
Hiroshima - Fab 15, Japan
13d
Develop, optimize, and sustain advanced dry etch processes for DRAM manufacturing while leading yield, quality, and productivity improvement initiatives.
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NTI Physical Failure Analysis Technician
Micron
Fab 10N/X, Singapore
13d
Physical Failure Analysis (PFA) technician identifying root causes of yield issues in next-generation semiconductor memory products through hands-on analysis and process integration.
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Applications Development Engineer
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Kla
Singapore, S00, SG
13d
Deliver high-impact work in semiconductor inspection, metrology, and analytics systems to support chip manufacturers in detecting defects and monitoring process quality.
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Senior Facility Water Treatment Engineer
Micron
Tainan, Taiwan
13d
Coordinate operation, maintenance, and expansion of semiconductor water treatment systems (UPW, Non-Potable, Reuse, Distillation, Wastewater) while leveraging AI and data analytics for predictive maintenance and operational efficiency.
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Senior Principal Foundry Engineer
Nxp
Hsinchu
13d
Drive lead product ramp-up under new technology introduction (NTI) by collaborating with external foundries to ensure stable chip supply and manufacturability.
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Engineer, Yield Enhancement PDE (Package Development Engineering)
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Micron Technology
SG
13d
Monitor, manage, and stabilize yield for High Bandwidth Memory (HBM) New Product Introduction (NPI) builds from first silicon through early High Volume Manufacturing (HVM).
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Technician, HBM MFG
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Micron Technology
SG
13d
Execute daily production activities, monitor process parameters, and operate automated equipment in a high-volume semiconductor manufacturing cleanroom to ensure safe, stable, and efficient production.
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Engineer, Metro Real-time Defect Analysis (RDA) Process & Equipment
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Micron Technology
SG
13d
Develop, deploy, and sustain Real-time Defect Analysis (RDA) capabilities for advanced packaging and New Product Introduction (NPI) manufacturing environments to ensure process control and equipment performance.
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Shift Engineer, Metro Real-time Defect Analysis
↗
Micron Technology
SG
13d
First-line technical responder ensuring stable operation of advanced packaging equipment during New Product Introduction (NPI) and early-life production phases.
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ENGINEER, High Bandwidth Memory (HBM) & New Product Introduction (NPI)
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Micron Technology
SG
13d
Engineer supporting the transition of next-generation memory and HBM packaging technologies from development to high-volume manufacturing.
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Semiconductor Engineer.
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UK Engineering Consultancy Pte. Ltd.
Singapore, S00, SG
13d
Design semiconductor circuits and optimize fabrication processes to boost production yield.
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Equipment Engineer - DM5 - Implant
Texas Instruments
Dallas, TX, United States
13d
Ensure reliability and optimize performance of semiconductor manufacturing equipment, specifically ion implantation tools.
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Multi-Vision Systems Engineer
Amat
Hsinchu,TWN
13d
Design, integrate, and optimize complex semiconductor process control (PDC) systems to support fab automation and production flow.
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Chemical Engineer II
↗
Rasirc
San Diego, CA, US
$85k–$85k
13d
Lead operation, monitoring, and optimization of chemical process systems producing high-purity specialty chemicals for semiconductor manufacturing.
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Principal Engineer Technology Development (f/m/div)
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Infineon Technologies
Villach, K, AT
13d
Lead technology development and innovation projects for Power MOSFETs, driving device concepts from definition through mass production release.
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Manufacturing Engineer – Solar Cell Assembly (Experienced)
Boeing
USA - Sylmar, CA
$111k–$111k
13d
Manufacturing Engineer supporting day-to-day solar cell assembly production, process development, and capital equipment introduction for high-efficiency space solar cells.
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Production Specialist
Texas Instruments
Melaka, Malaysia
13d
Operate equipment to align, mask, etch, diffuse wafers in fabs or perform test, tap, reel, mark, and pack functions in assembly test sites.
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Senior Engineer Technology Development (f/m/div)
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Infineon Technologies
Villach, K, AT
13d
Develop Backend of Line solutions for wafer technology and product features to realize power devices addressing application needs.
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Process Engineer
Cochlear
Brisbane, Queensland
13d
Develop stable and reliable manufacturing processes for new and existing implantable hearing devices, supporting quality, yield, and efficiency initiatives.
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Principal Electrical Engineer
Renesas-Electronics
San Jose, CALIFORNIA, us
$198k–$198k
13d
Provide technical leadership in semiconductor device and process technology development and product enablement for automotive, industrial, infrastructure, and IoT applications.
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Manager, Field Process
Asm
Taichung(ASM Front-end Taiwan)
13d
Lead process teams to drive customer new product penetration and maintain application positions with HVM teams for semiconductor modules.
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Manufacturing Support Direct
Renesas-Electronics
Saijo, jp
13d
Maintain semiconductor manufacturing equipment reliability through preventive maintenance, troubleshooting, and continuous improvement to support AI power device production.
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Manufacturing Engineer Packaging & OSAT
Tenstorrent
Taiwan
14d
Own the manufacturing interface between package design, semiconductor assembly, package test, board assembly, and final product integration to make advanced packages manufacturable and transferable to OSAT processes.
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不良解析エンジニア (交替勤務)
Renesas-Electronics
Kodaira, jp
14d
Semiconductor device failure analysis using ATE, X-ray inspection, optical/electron microscopy, and chemical processing.
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Engineer, Product Engineering (Mfg.)
Analogdevices
Philippines, Cavite, GTC
14d
Deliver strategic improvement initiatives and technical assistance to supplier manufacturing factories to increase product yields, minimize scrap costs, and reduce full factory costs.
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Packaging Module Development Engineer
Intel
US, Arizona, Phoenix
$134k–$134k
14d
Design, optimize, and qualify packaging assembly processes and equipment for advanced semiconductor products.
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Optics Coater 1
Mksinst
Romania Bucharest
14d
Operating high-vacuum coating equipment to apply optical coatings and perform spectral measurements for advanced applications like 5G, autonomous vehicles, and space exploration.
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Senior Engineer, Node Development PE
Micron
Boise, Idaho, United States of America
14d
Lead new DRAM node startup, qualification, yield ramp, and production readiness at the ID1 fab, connecting development to manufacturing.
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Engineer - QEM PQE YIELD
Micron
Fab 10N/X, Singapore
14d
Fab Engineer responsible for new product startup, sustaining high-volume yield, and driving process/equipment optimization to improve product quality and reliability in semiconductor manufacturing.
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Service Engineer (Semiconductor Backend)
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Recruit Expert Pte. Ltd.
Outram, S00, SG
14d
Install, commission, support, and maintain semiconductor equipment at customer sites, including troubleshooting, upgrades, and preventive maintenance.
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Manufacturing Specialist Operator Night
ON Semiconductor
Gresham, OR, United States
14d
Load wafers into production equipment, verify product specs, monitor equipment operation and process pace, and recognize adjustments needed in a semiconductor manufacturing clean room.
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Summer 2027 - System Engineer - Central Utility Plant
ON Semiconductor
Hopewell Junction, NY, United States
$0k–$0k
14d
Support the Facilities Engineering team in maintaining and improving critical utility systems for semiconductor manufacturing operations.
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Systems Engineer IV
Amat
Santa Clara,CA
$161k–$161k
14d
Design, integrate, and optimize complex semiconductor equipment systems and subsystems to advance materials science and chip manufacturing.
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Process Engineer V
Amat
Santa Clara,CA
$163k–$163k
14d
Designing and optimizing manufacturing processes for display and semiconductor technologies, leading R&D projects, and resolving complex customer process issues.
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