Analog IC Design
1,494 open positions
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STA & Custom Logic Design Engineer AppleSunnyvale, United States of America 22d Perform timing analysis and develop custom logic design for analog/mixed-signal circuits to connect world-class products.
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Staff Systems Design Engineer AnalogdevicesUS, CA, San Jose, Rio Robles $151k–$151k22d Drive next-generation mixed-signal IC products from concept through production silicon, working across analog, digital, firmware, and system architecture.
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Mixed-Signal CMOS Design Engineer FlirUS - Camarillo, CA $91k–$91k22d Design and develop mixed-signal CMOS integrated circuits and readout integrated circuits for next-generation infrared imaging sensors.
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Memory Circuit Design Engineer - TCAM/SRAM CiscoZhubei, Taiwan 22d Design, develop, and test TCAM and SRAM memory circuits for electronic systems, ensuring performance, reliability, and safety standards.
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BCD Technologist Texas InstrumentsDallas, TX, United States 22d Lead the development and integration of next-generation Bipolar-CMOS-DMOS (BCD) technologies for analog and power products.
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Advanced Packaging Intern, BS - Summer 2027 MarvellBurlington, VT $64k–$129k22d Intern supporting customers with advanced package designs meeting challenging electrical requirements for high-speed signaling and power delivery.
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R&D Engineer LumentumRemote - Israel 22d Design, test, and characterize optical transceivers and high-speed communication modules for data-center and AI network architectures.
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IC Design Engineer Manatal Test accountMilton, Queensland 23d Design and develop integrated circuits for consumer electronics, automotive, and industrial products.
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Design Engineer↗ ArmKA, IN 23d Develop and optimize Arm custom standard cells for advanced sub-3nm process technologies to improve power, performance, and area (PPA) of SoCs.
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Entry Level Digital Physical Design Engineer NxpAustin (Oakhill, Office) 23d Entry-level engineer supporting physical design activities including layout implementation, rule checks, and design data preparation for semiconductor products.
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IC Digital Design Intern SonyglobalLysaker 23d Design and development of advanced CMOS image sensors, specifically timing/control signals for pixel array readout, amplifiers, ADCs, signal processing blocks, I/O interfaces, and low noise power supplies.
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Senior Engineer Analog Mixed-Signal Design (f/m/div)↗ Infineon TechnologiesVillach, K, AT $47k–$47k23d Design analog/mixed-signal blocks and ensure top-level functionality for semiconductor solutions in power systems and IoT.
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Senior/ Staff/ Principal - Silicon Design Validation Engineer MicronHyderabad - Phoenix Aquila, India 23d Develop, validate, characterize, and qualify new NAND Flash memory products through silicon design validation.
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Research Fellow (IC Design and academic) NtuNTU Main Campus, Singapore 23d Design and realize high speed high efficiency analog/RF ICs, specifically RF power management ICs, while supporting teaching activities.
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Analog Circuit Design Engineer IntelIndia, Bangalore 23d Design, develop, and build analog circuits in advanced process nodes for analog and mixed-signal IPs, optimizing for power, performance, area, timing, and yield.
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Engineer (Semicon, One North)↗ PersolSingapore, S00, SG $8k–$8k23d Custom Layout Engineer supporting physical implementation of Foundation IP, Analog IP, and RFIC designs across advanced semiconductor process technologies.
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?Silicon Photonics Chip & System Architecture Engineer↗ Clementi, S00, SG 23d Define system-level architecture for next-generation high-speed silicon photonics solutions (800G, 1.6T, 3.2T), translating requirements into chip-level optical and electrical specifications.
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Analog IC Design Engineer↗ Tetramem Singapore Pte. Ltd.Singapore, S00, SG 23d Design and development of high-performance analog integrated circuits including amplifiers, data converters, and voltage regulators.
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?Silicon Photonics PIC Design & Process Engineer↗ Clementi, S00, SG 23d Physical implementation and manufacturability of silicon photonic integrated circuits (PICs), bridging design and semiconductor manufacturing for AI data center infrastructure.
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PRINCIPAL R&D/PRODUCT DVL ENGINEER Te-ConnectivityUSA 24d Lead end-to-end product development of high-speed, fine-pitch, large-size sockets for digital data networks, focusing on concept development, design validation, and customer collaboration.
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Staff Package Design Engineer- experienced in package development of power SiP/module Renesas-ElectronicsZhubei, tw 26d Design and develop package and interconnect methods for power SiP/modules, wafer level, flip-chip, and multi-chip module applications.
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Principal Field Application Engineer - Optical Connectivity SemtechUSA - San Jose, CA $180k–$180k26d Principal Field Application Engineer driving design wins and leading co-development for high-speed optical and copper interconnect solutions in AI data centers.
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Senior Mask Layout Design Engineer NVIDIATaiwan, Hsinchu 26d Perform physical layout for mixed-signal functions (PLLs, high-speed I/O, ESD structures) in sub-micron CMOS technologies.
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Principal Design Engineer CadenceHYDERABAD 26d Architect, design, and deliver high-speed Analog/Mixed-Signal IPs and subsystems for next-generation connectivity and memory interfaces.
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Senior Staff Advance Packaging Engineer↗ AMDBedok, S00, SG 26d Lead end-to-end package design execution for complex heterogeneous integration products (2.5D/3D, chiplet-based) to ensure performance, cost, and schedule targets.
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Director of 3D Stacked Logic Design SkhynixamericaSan Jose, CA $250k–$250k27d Lead design and implementation of high-speed digital IP for 3D-stacked DRAM peripheral circuits and DFT, driving co-development with U.S. customers for DRAM-on-Logic systems.
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Lead Systems Signal Integrity/Power Integrity Engineer CerebrasSunnyvale, CA $220k–$220k27d Lead System Signal Integrity and Power Integrity Engineer solving complex integrity challenges in next-generation AI compute systems.
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Engineer II- Product↗ Microchip TechnologyBurnaby, BC, CA $76k–$76k27d Characterize, analyze, and debug high-speed SERDES architectures (up to 32Gbps NRZ/128Gbps PAM4) for datacenter, automotive, and space applications.
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Memory Circuit Design Engineer↗ Intel CorporationAustin, TX, US $164k–$269k27d Design and development of advanced memory circuits (SRAMs, caches, register files, ROMs) for future CPU and SoC products to enable industry-leading power, performance, and area (PPA) on advanced CMOS processes.
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