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Hardware & Physical Engineering
› Analog IC Design
Analog IC Design
1,501 open positions
Hardware Engineer
Cisco
Taipei, Taiwan
28d
Design advanced substrate and ASIC package layouts (BGA, flip-chip, SiP, multi-die) and HDI/mSAP PCBs for next-generation Cisco optical engines.
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Principal IC Analog / Mixed Signal Design Engineer
Analogdevices
US, MA, Wilmington
$157k–$157k
28d
Lead analog and mixed-signal circuit design for high-reliability power, connectivity, and analytics solutions in hyperscale data center platforms, specifically mixed-signal SoCs combining precision analog front-ends, high-speed data converters, and embedded…
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Memory Circuit Design Engineer
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Intel Corporation
Austin, TX, US
$164k–$269k
28d
Design and development of advanced memory circuits (SRAMs, caches, register files, ROMs) for future CPU and SoC products to enable industry-leading power, performance, and area (PPA) on advanced CMOS processes.
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Lead Systems Signal Integrity/Power Integrity Engineer
Cerebras
Sunnyvale, CA
$220k–$220k
28d
Lead System Signal Integrity and Power Integrity Engineer solving complex integrity challenges in next-generation AI compute systems.
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Engineer II- Product
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Microchip Technology
Burnaby, BC, CA
$76k–$76k
28d
Characterize, analyze, and debug high-speed SERDES architectures (up to 32Gbps NRZ/128Gbps PAM4) for datacenter, automotive, and space applications.
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Senior / Distinguished Member of Technical Staff — Silicon Photonics Engineer
Micron
4 Locations
$189k–$189k
28d
Establish and lead the silicon photonics technical discipline at Micron, defining optical interconnect architecture and evaluating partner PIC designs to enable high-speed interconnects for AI and advanced computing.
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Memory Circuit Design Engineer
Intel
US, Texas, Austin
$164k–$164k
28d
Design and development of advanced memory circuits (SRAMs, caches, register files, ROMs) for future CPU and SoC products to enable industry-leading power, performance, and area (PPA) on advanced CMOS processes.
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Senior PCB Design Engineer
Arista-Networks
Santa Clara, CA, us
$133k–$133k
28d
Design and develop ultra-high-speed networking platforms, including optical interface platforms up to 800G and 1.6T, for enterprise campuses, hyperscale datacenters, and AI clusters.
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Staff Analog Engineer
Renesas-Electronics
Kodaira, jp
28d
Design analog blocks and higher-level sub-blocks for new semiconductor products, collaborating with digital and layout teams.
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Lead Engineer Analog ASIC Design (f/m/div.)
Bosch-Group
Remote
$88k–$88k
28d
Provide technical leadership for analog ASIC design sub-teams to develop next-generation power management solutions for the automotive industry.
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Analog Layout Lead
Lumilens
San Jose
29d
Lead full-custom analog and mixed-signal layout for next-generation silicon platforms, ensuring performance, reliability, and tape-out readiness.
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Application Engineer
Siemens-Eda
Tokyo, JPN, Japan
29d
Primary technical interface and trusted advisor for assigned customers, helping them understand, evaluate, and deploy the Solido Custom IC design and verification platform.
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Senior Analog Designer
Nxp
Toulouse
29d
Lead architectural definition, design, simulation, and verification of complex analog and mixed-signal circuits (ADCs, DACs, amplifiers, voltage regulators, PLLs) from concept to silicon.
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Optical Hardware Engineering Technical Leader, Acacia (Hybrid)
Cisco
Maynard, Massachusetts, US
$179k–$179k
29d
Lead optical hardware engineering for next-generation low-power, high-performance coherent optical transceivers used in data centers and telecom networks.
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Senior SERDES/C2C First-Silicon Bring-Up Engineer
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Semidynamics
Barcelona, CT, ES
29d
Senior IC engineer responsible for first-silicon bring-up of physical SERDES/C2C interfaces, isolating failures across PHY, clocking, calibration, and controller layers to transition from verification collateral to deterministic executable flows.
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Mixed-signal Design Architect, HBM Architecture
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Micron Technology
Richardson, TX, US
$146k–$146k
29d
Design, simulate, and optimize the architecture of 3D-stacked, high-performance mixed-signal memories for next-generation AI systems.
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Senior Engineer/ Engineer – Package Silicon Integration Engineer
Micron
Hyderabad - Phoenix Aquila, India
29d
Integrate new silicon technologies with package platforms for memory applications, utilizing virtual prototyping and simulation to resolve integration challenges and define design rules.
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Principal Hardware Engineer
Lumentum
USA - CA - San Jose (Ridder)
$135k–$135k
29d
Subject-matter expert in hardware design, opto-electronic packaging, and materials science for high-performance optical transceivers.
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Senior Principal Analog Engineer -Power Management
Nxp
Hsinchu
29d
Lead the definition, architecture, design, verification, and validation of complex analog and mixed-signal integrated circuits for hybrid converter and power delivery solutions in automotive and robotics applications.
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Analog IC Design Engineering Intern - MS/PhD
Texas Instruments
Dallas, TX, United States
29d
Architect new TI products by defining, designing, modeling, implementing, and documenting analog, digital, and RF integrated circuits (ICs) across domains like audio, imaging, automotive, and power supply.
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Analog IC Design Engineer
Texas Instruments
Bengaluru, Karnataka, India
29d
Designs and implements analog, analog-mixed signal & integrated circuits (ICs) enabling new TI products and customer solutions.
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SPOT Memory Engineer
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Ambiq Micro Singapore Private Ltd.
Outram, S00, SG
29d
Design and validate ultra-low-power embedded SRAM and Register File IPs for advanced SoCs operating in near-threshold and sub-threshold voltage ranges.
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Analog Design Engineer
Nxp
Toulouse
29d
Design, simulate, and verify critical analog blocks (ADCs, DACs, PLLs, LDOs, amplifiers, bandgap references) for high-performance mixed-signal integrated circuits.
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Analog Field Applications Engineer (Santa Clara, CA)
Texas Instruments
Santa Clara, CA, United States
29d
Partner with Sales to provide analog technical expertise throughout the sales cycle, solving customer projects and creating new opportunities.
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Analog Circuit Design Engineer (High Speed Serdes)
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Geylang, S00, SG
29d
Design and develop high-speed SerDes PHY circuits (PLL, CDR, CTLE) for advanced node semiconductor solutions.
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R&D Engineering, Principal Engineer
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Synopsys
Mississauga, ON, CA
29d
Principal Engineer leading end-to-end Signal and Power Integrity (SIPI) for high-speed SerDes interfaces (PCIe Gen6/7/8, E224G, E448G, CXL) across silicon, package, board, and compliance fixtures.
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R&D Engineer IC Design
Broadcom
Korea-Seoul-HiBrand, KR
29d
Design advanced RF power amplifiers for RF front-end modules, covering architecture, transistor-level circuit design, simulation, layout, and validation.
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Technology Development Quality and Reliability Engineer
Intel
US, Oregon, Hillsboro
$156k–$220k
29d
Develop solutions and design rules to ensure Electrostatic Discharge (ESD) and Latch-up (LU) reliability in circuits during technology development.
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Experienced ASIC Analog Layout Engineer (m/f/d)
Aumovio
Regensburg, BY, de
29d
Top-level integration of analog and mixed-signal ICs, driving layout development for robust, DRC-compliant designs with optimal area utilization.
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PMU Analog Layout Design Intern (m/f/d)
Apple
Munich, Germany
1mo
Support transistor-level layout of analog circuit blocks for Power Management ICs powering Apple products.
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R&D Staff Hardware Engineer
Broadcom
USA-CA San Jose Innovation Drive
$122k–$122k
1mo
Design, develop, and deliver Ultra High-performance electronic products with full ownership of EE hardware design from BOM creation to validation and field support.
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Lead Design Engineer
Cadence
BANGALORE
1mo
Design and verify high-speed, low-power SerDes transceivers for data-center, networking, AI, and high-performance computing applications.
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Staff Analog IC Engineer
Semtech
IND - Hyderabad
1mo
Design and develop high-accuracy analog and mixed-signal ICs, taking ownership of critical chip subsystems.
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High Speed Digital and Photonics Applications Engineer
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Keysight Technologies
Yishun, S00, SG
1mo
Strategic customer-facing engineer driving adoption of high-speed digital and optical solutions for AI datacenters, HPC, and silicon photonics.
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Ingénieur Chercheur device CMOS avancé H/F
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Cea
Remote
1mo
Advanced CMOS transistor development from technological design to detailed electrical performance analysis.
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CPU Circuit Memory Design Engineer
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Intel Corporation
Austin, TX, US
$142k–$142k
1mo
Design, develop, and optimize custom embedded memory solutions (SRAMs, caches, register files, ROMs) for high-performance, power-efficient Intel CPUs and SoCs.
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Design Verification Engineer
Texas Instruments
Bengaluru, Karnataka, India
1mo
Confirm accuracy of analog and mixed signal electronic designs, components, and integrated circuitry before pattern generation and mask development.
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IC Packaging Engineer
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Apple
Cupertino, CA, US
$150k–$150k
1mo
Architect thermal solutions for mobile devices to address chip energy efficiency and performance scaling.
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Senior Memory Design Engineer, HBM
Micron
Richardson, TX
1mo
Design, simulate, and optimize DRAM circuits (digital, analog, and memory core) for advanced memory products, ensuring manufacturable and high-quality solutions.
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Senior Mask Layout Design Engineer
NVIDIA
Taiwan, Hsinchu
1mo
Performing physical layout for high-speed mixed-signal circuits (PLLs, SerDes, ADCs, ESD) in sub-micron CMOS technologies.
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Logic Designer
Altera
Haifa, Israel
1mo
Designing digital logic and DSP algorithms for mixed-signal IP blocks including high-speed SerDes, ADC/DAC digital, calibration engines, and control logic.
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Optical Module Hardware FAE Intern
Marvell
CN - Wuhan
1mo
Support customer engagements and debug hardware/software systems for optical module products using PAM4 DSP, linear TIA, driver, and Coherent DSP technologies.
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IC Package / PCB Layout Engineer (d/m/f)
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ams-OSRAM AG
Unterpremstätten, ST, AT
1mo
Design and develop RF and high-frequency IC substrate and PCB layouts for sensor and mixed-signal applications, ensuring compliance with electrical, thermal, and manufacturing requirements.
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Mixed-Signal Design Engineer
Analogdevices
US, MA, Wilmington
$87k–$87k
1mo
Designing high-speed data converters (RF DACs, ADCs, SerDes PHYs) in FinFET processes for SoC integration.
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Lead Validation Engineer Analog
Nxp
Noida
1mo
Develop bench characterization methodologies and perform design evaluation for Analog/Mixed-Signal IPs across PVT combinations.
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I/O Design Engineer
Broadcom
Singapore-Yishun
1mo
Design and verification of analog and mixed-signal I/O IP, including CMOS I/O, bandgap references, op-amps, and comparators for advanced nodes.
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Manager for IO and Mixed Signal Design
Broadcom
Singapore-Yishun
1mo
Leading and managing a team of electrical engineers to develop, design, and test IO and analog mixed signal IP for Broadcom's diverse business units and customers.
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DSP Engineer
Lumilens
San Jose
1mo
Develop advanced DSP algorithms and hardware designs for ultra-high-speed serial data measurements supporting AI infrastructure.
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Developer - Silicon Platform Validation, Python
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HCLTech
Edmonton, AB, CA
1mo
Architecting, designing, and delivering memory layout solutions for hardware and embedded systems projects.
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DSP Application Engineer, Staff
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Qualcomm
Ottawa, ON, CA
$109k–$109k
1mo
Staff DSP Application Engineer supporting customer adoption and deployment of next-generation DSP solutions in Optical Transceivers and Active Electrical Cables (AEC) for AI and cloud infrastructure.
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