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Software Engineering
› Hardware Verification
Hardware Verification
784 open positions
Experienced CAD Automation Engineer (Design Verification)
Apple
Saint Albans, United Kingdom
7mo
Automating chip design processes and optimizing simulation tool performance for Apple hardware products.
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NAND BM IP DV Engineer
Samsung Electronics
7mo
Developing test environments, test benches, bus protocol checking, transaction level checking, and constraint random verification for Samsung memory products.
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Digital Engineer Intern
Renesas-Electronics
Lviv, ua
7mo
Design, simulation, verification, and lab evaluation of basic digital circuits.
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Java Tech Lead
Amat
Bangalore,IND, IN
7mo
Lead the design, development, and delivery of complex software solutions for semiconductor and display equipment components.
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AI/CAD Software Engineer
Falcomm
Atlanta, Georgia, United States
7mo
Develop AI-driven tools to automate RF hardware design, optimize Power Amplifier (PA) performance, and accelerate tape-out processes.
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Software Engineer for SPICE (math)
Cadence
BEIJING
7mo
Developing mathematical and probabilistic algorithms to enhance the accuracy, robustness, and performance of simulation and analysis tools for next-generation EDA technologies.
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Intern of the Device Modeling
Cadence
BEIJING 04
7mo
Assist with Spectre Device modeling projects to speed up performance and enhance reliability aging models for specific device types.
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ML/AI Software Engineer
Cadence
SHANGHAI
7mo
Domain: Electro-thermal / Electromagnetic / Structural simulations Preferred skills: Electrical Engineering, Computer Science, AI project experience, PhD degree
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Application Engineer
Cadence
YOKOHAMA
7mo
Provide technical support for Cadence's advanced software tools used for designing and verifying semiconductor and electrical/electronic systems.
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Front-End Manufacturing Engineering Production Supervisor
Micron
Taoyuan - Fab 11, Taiwan
8mo
Lead front-end manufacturing production line performance, focusing on designated areas to ensure alignment and continuous improvement of production processes.
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Intern
Cadence
CORK 01
8mo
Implementing microprocessor cores and multiprocessor sub-systems in RTL for Xtensa processors, focusing on timing, area, and power goals for intelligent IoT devices.
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software engineering intern
Cadence
BEIJING
8mo
Research and develop new technology to speed up large-scale transistor-level post-layout circuit simulation within the Spectre FX (FastSPICE) circuit simulator.
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Senior/Staff/Principal Engineer, Product Engineering
Micron
Hyderabad - Phoenix Aquila, India
8mo
Develop, validate, characterize, and qualify new state-of-the-art NAND Flash memory products through post-silicon validation and test program development.
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Senior Modeling Engineer
Analogdevices
India, Bangalore, Nova
8mo
Lead the definition, development, and maintenance of system-level models for high-speed RF converter-based products and RF integrated transceivers to support architecture exploration, performance analysis, and design validation.
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Frontend Organizations Central Team, Staff / Principal Photo Scanner Engineer
Micron
Fab 10A, Singapore
8mo
Provide deep technical and operational leadership to drive best-in-class photo scanner performance, uptime, utilization, and productivity across the global Micron manufacturing network.
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Principal Engineer/MTS – Member of Technical Staff, HIG-HBM Product System Engineering (Media Health Reliability)
Micron
Fab 10A, Singapore
8mo
Spearhead and develop a high-performing team driving intrinsic and extrinsic reliability test development and execution for Micron's latest High Bandwidth Memory (HBM) products.
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Senior Design Engineer
ON Semiconductor
Bangalore, Karnataka, India
8mo
Developing digital blocks and automation frameworks for power management products including DC-DC PMIC, multiphase controllers, and SiC drivers.
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Principal Engineer/MTS – Member of Technical Staff, HIG-HBM Product System Engineering (Media Health Manufacturing)
Micron
Fab 10A, Singapore
8mo
Lead manufacturing test flow development, validation, and yield improvement for High Bandwidth Memory (HBM) products across DRAM, Interface, and Stacked Die architectures.
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Staff Engineer, Package Development & Engineering
Micron
MSB, Singapore
8mo
Providing technical leadership and strategic oversight for advanced packaging initiatives to drive technology enablement, yield acceleration, and integration of next-generation packaging solutions.
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Calibre LVS Principal Software Engineer
Siemens-Eda
Wilsonville, OR, United States
$130k–$130k
8mo
Design, develop, and optimize features for Calibre LVS/DRC tools to ensure accuracy, performance, and usability in electronic design automation.
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Manager, Planning Digital Twin
Micron
Fab 10A, Singapore
8mo
Lead a team to deliver business value through advanced analytics and data-driven solutions for strategic planning and operational excellence in the semiconductor industry.
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MTS/Principal Engineer, Wet Process Engineering, NAND Advance Node
Micron
Fab 10N/X, Singapore
8mo
Lead process development for WET processes in NAND memory technology, performing experiments, material/chemical characterization, and process integration.
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Firmware Field Application Engineer_Taipei
MediaTek
Taipei
8mo
Supporting MediaTek scaler SoC monitor projects by implementing monitor functions and applications for customers.
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<Data center>System Architect Design Engineer
MediaTek
HsinChu
8mo
Define architecture and specifications for high-speed UCIE development through simulations and verification.
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R&D Senior Hardware Developer
Hitachi
Vaesteras, Vastmanland County, Sweden
8mo
Lead and oversee the development of class-leading hardware solutions for protective relays, managing the full project lifecycle from concept to delivery.
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<Data center>System Expert for Post-silicon
MediaTek
HsinChu
8mo
Developing system firmware, high-speed physical layer data transmission software, and optimizing hardware performance for customized ICs in Enterprise/AI/xPU industries.
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Java Tech Lead
Amat
Bangalore,IND, IN
9mo
Lead the design, development, and launch of new software features and enhancements for semiconductor equipment components and devices.
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Electron Optics Devices Software Engineer
Amat
Rehovot,ISR
9mo
Develop and maintain device drivers and platform flows for advanced semiconductor inspection tools that interface with real hardware.
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Design Verification DDR Lead
MediaTek
Bangalore
9mo
Develop and implement comprehensive verification plans, testbenches, and environments for HBM4/4e IP and Subsystem using SystemVerilog and UVM.
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SoC Front End Design Engr
Nxp
Noida
9mo
Design and develop complex System-on-Chip (SoC) architectures for next-generation automotive and IoT products.
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Wireless Communication System Digital IC Design Engineer
MediaTek
ChuPei
9mo
Design, develop, and verify digital circuits for wireless communication systems like WiFi and modem baseband.
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Software Engineering Intern
Kla
Ann Arbor, MI
$0k–$0k
10mo
Intern working with AI and Modeling Center of excellence to improve KLA products using machine learning, deep learning, and physics modeling.
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Lead Software Engineer for Virtuoso ADE
Cadence
BEIJING
10mo
Developing scalable intelligent IC design software and streamlining tool flow for simulation and visualization teams.
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Sr. Mobile System Engineer
Micron
Hashimoto, Japan
10mo
Setting up evaluation environments and testing, debugging, characterizing, and evaluating the performance of low-power DRAM products to ensure compatibility on mobile systems.
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Software Tech Support Engineer
Amat
Bangalore,IND
10mo
Provide software support for semiconductor manufacturing equipment installed at customer sites, resolving complex issues and driving feature developments.
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DFM Automation & AI Tools Development Engineer
Apple
Cupertino, United States of America
11mo
Develop automated tools and AI models to improve design review, manufacturing efficiency, and environmental impact for Apple's complex PCBA and Flex designs.
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Lead Design Engineer
Cadence
BANGALORE
11mo
Develop firmware for DDR5 PHY using microcontrollers and collaborate on training algorithms for memory subsystems.
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Field Application Engineering Manager, Front-End Solutions
Siemens-Eda
Tokyo, JPN, Japan
$12000k–$18000k
11mo
Lead the technical sales and application engineering team to drive new tool adoption and support existing customers in the EDA industry.
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Modem Digital Front-End/Back-End Design Integration(5G/6G)
MediaTek
HsinChu
1y
Designing 5G/6G modem architecture and digital circuits, including SoC integration from RTL to gate level.
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Senior SOC Modeling Engineer
Arm
Bengaluru, India
1y
Develop high-performance functional models of Arm system-level IP and virtual platforms to enable early software development and architecture exploration before silicon availability.
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Hardware Developer
Hitachi
Vaesteras, Vastmanland County, Sweden
1y
Developing FPGA applications for power transmission network protection and component solutions.
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ML Software Engineer Intern - AI/CAD Integration
Falcomm
Atlanta, Georgia, United States
1y
Develop and deploy AI/ML models to enhance CAD workflows, automate design processes, and accelerate innovation in RFIC design.
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Principal Product Engineer
Cadence
BANGALORE
1y
Engineer characterization solutions and methods for foundational IPs, working with R&D and Customer Engagement teams to influence software tool development for advanced chip design platforms.
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Solutions Architect - AE
Cadence
BANGALORE
1y
Drive RTL-to-GDSII metrics, deploy ML-based solutions, and produce out-of-the-box solutions to customer problems for semiconductor design tools.
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<Automotive>Senior digital designer and power architect
MediaTek
HsinChu
1y
Design and integrate digital IP for power control in smartphones and automotive products, and define long-term power control architectures.
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Senior Frontend PHY IC Design Engineer (DSP focus)
Morse-Micro
Remote
1y
Design, integration, verification, and bring-up of IEEE 802.11ah PHY layer for low-power Wi-Fi chips enabling IoT.
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Assembly Backend Technician (System & Tooling )
Nxp
Kuala Lumpur
1y
Maintaining and sustaining Trim & Form systems and tooling in the Assembly Backend to ensure manufacturing goals, minimize downtime, and maintain product quality.
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HBM SOC Design Engineer
Micron
Richardson, TX
1y
Design and development of next-generation HBM DRAM products, focusing on SOC architecture, RTL logic, IP integration, and high-speed interface design.
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Modem ESL (Electronic System Level) Modeling Engineer
MediaTek
HsinChu
1y
Developing behavior, cycle-accurate, and power models for next-generation modem and processor architectures.
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Fullstack Software Engineer
TSMC
USA-Arizona
1y
Design, develop, and maintain automation software solutions integrating semiconductor manufacturing equipment with production systems.
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