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Hardware & Physical Engineering
› ASIC Physical Design
ASIC Physical Design
1,650 open positions
SOC Timing Analysis (STA) Engineer ,HBM
Micron
Richardson, TX
3mo
Own chip-level static timing sign-off and methodology development for next-generation High Bandwidth Memory (HBM) dies in sub-5nm nodes.
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ASIC DFT STA Technical Lead
Cisco
2 Locations
$169k–$169k
3mo
Lead Static Timing Analysis (STA) and Design for Test (DFT) for next-generation networking ASICs, ensuring timing closure and quality across implementation and post-silicon phases.
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Compute Subsystem Architect
MediaTek
San Jose, CA
3mo
Define and build compute subsystem capabilities for next-generation ASIC and advanced Arm computing platform products, covering core configuration, cache architecture, and interconnect topology.
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Digital Design Engineer
Accenture
Bengaluru
3mo
Design and implement digital circuits and systems with a focus on logic, timing, and power optimization.
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SoC Timing (Static Timing Analysis/STA) Engineer, HBM
Micron
Richardson, TX
3mo
Own end-to-end chip-level static timing analysis and sign-off for next-generation die, ensuring timing integrity across all modes and corners from initial design through tape-out.
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Digital IC Design Engineer
Texas Instruments
Dallas, TX, United States
3mo
Design and verify digital logic for next-generation power management and analog ICs serving industrial, automotive, and consumer applications.
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Physical Design Engineer
Accenture
Bengaluru
3mo
Translate logical circuit designs into physical layouts, optimizing for area, power, and timing while ensuring manufacturing constraints are met.
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Physical Design Engineer
Accenture
Bengaluru
3mo
Translate logical circuit designs into physical layouts, optimizing for area, power, and timing while ensuring manufacturing constraints are met.
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Senior ASIC Hardware Design Engineer
NVIDIA
Israel, Beer Sheva
3mo
Design and implement high-performance, low-power security engines and RISC-V processor modules for NVIDIA's CPU and SoC product lines.
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Hardware Design Engineer
Purestorage
Office - Taipei (Taiwan)
3mo
Architect and launch next-generation high-performance solid-state storage solutions from concept to global mass production, focusing on high-speed hardware interfaces to reduce TCO and energy consumption.
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Principal Design Engineer - Physical Design
Cadence
SHANGHAI
3mo
Lead high-speed digital DDR PHY IP physical implementation and optimize design flows for cutting-edge semiconductor processes.
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Principal Engineer, Automated Derivatives
Renesas-Electronics
Remote
3mo
Lead end-to-end delivery of derivative System-on-Chips (SoCs) by building an AI-augmented 'Silicon Factory' that uses machine learning to bridge architectural intent and GDSII, focusing on ultra-fast turnaround times.
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Principal Engineer, Router Architect
Renesas-Electronics
Remote
3mo
Architecting high-bandwidth, ultra-reliable Ethernet Routing Engines and PCIe subsystems to serve as the primary data fabric for Autonomous Driving and Cockpit controllers.
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Engineer, Performance Modelling
Renesas-Electronics
Remote
3mo
Develop and maintain performance models for System-on-Chip (SoC) designs using SystemC TLM 2.0 to optimize performance and ensure successful product delivery.
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Hardware Engineer
Imc
Chicago
$200k–$200k
3mo
Design and verify custom ASICs for low-latency trading infrastructure, collaborating with software and research teams to solve complex hardware challenges.
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Principal System Engineer
Nxp
Caen, FR
3mo
Lead architectural definition, design, and implementation of complex embedded systems for next-generation semiconductor products.
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Manager, Design Verification
Analogdevices
CLOSED-India, Bangalore, Aveda Meta
3mo
Lead physical design implementation for complex block- and top-level SoCs, ensuring timing closure, power integrity, and signoff quality while leading a small engineering team.
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ASIC Engineering Technical Leader - CDC
Cisco
3 Locations
$184k–$184k
3mo
Lead Clock Domain Crossing (CDC) and Reset Domain Crossing (RDC) methodology for ASIC subsystems in Cisco's Silicon One chips, ensuring robust RTL design and verification for high-volume deployment.
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Senior Principal System Architect
Arm
San Jose, California
$323k–$323k
3mo
Define and explore next-generation system architectures and technologies for compute infrastructure across data center and networking domains.
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ASIC / Digital Design Director of Engineering
ON Semiconductor
Bangalore, Karnataka, India
3mo
Lead development of next-generation Automotive Networking solutions including SerDes, Ethernet, and high-speed communication SoCs.
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Senior Engineer, SoC Architecture – Memory Subsystem and Interconnect
Samsungresearchamerica
Mountain View, CA
$159k–$159k
3mo
Architecting next-generation SoC Fabric, System Cache, and DRAM Controller subsystems to optimize power, performance, and area for Samsung Galaxy devices.
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Senior GPU Floorplan Design Engineer
NVIDIA
India, Bengaluru
3mo
Design and optimize floorplans for next-generation GPUs during early chip development, balancing area, timing, and power constraints.
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Physical Design Technical Leader
MediaTek
San Jose, CA
3mo
Guide customers in selecting optimal EDA tools and flows, drive physical design flow execution from RTL to GDSII, and ensure tape-out quality meets MediaTek's standards.
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Principal Field Application Engineer - Edge AI
Arm
San Jose, California
3mo
Senior technical leader serving as a trusted advisor to strategic partners to drive design wins and adoption of Arm Edge AI technologies.
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FPGA IP Software Development Engineer
Altera
Bengaluru, Karnataka, India
3mo
Design, develop, and validate high-performance FPGA Soft IP solutions from micro-architecture definition through physical hardware validation.
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Senior Principal SoC Architect
Arm
Austin, Texas
$309k–$309k
3mo
Define system architectures for Infrastructure markets from edge to hyperscale systems using Arm technology, focusing on system topologies, performance metrics, and power expectations.
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Senior Principal Computer Architect AI/ML (f/m/d)
Nxp
Hamburg, DE
3mo
Design and advance state-of-the-art AI accelerator IPs for embedded products with real-world cost/power constraints.
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Principal Digital Design Engineer, Automotive
Nxp
Remote
3mo
Lead digital design teams to define and implement new capabilities for in-vehicle networking transceivers (2Gbs to 16Gps) providing video, audio, control, and Ethernet connectivity.
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Staff/Sr. Staff GPU Engineer – Shader System RTL Design/Microarchitecture
MediaTek
San Diego, CA
3mo
Design and optimize GPU shader system microarchitecture and RTL for industry-leading graphics and compute IP deployed in mobile, automotive, laptop, IoT, AI, VR/AR, and ASIC markets.
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Senior ASIC Design Engineer - XBAR IP
NVIDIA
India, Bengaluru
3mo
Designing state-of-the-art memory subsystem components for Graphics Processors, focusing on micro-architecture, RTL implementation, and verification.
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Senior Engineer, FPGA
Ambiqmicroinc
Singapore
3mo
Develop and render FPGA images for pre-silicon prototyping environments to support SoC design, verification, and system test teams.
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逻辑工程师
Sicarrier
China / Guangdong-Shenzhen,China / Shanghai-Shanghai,China / Hubei-Wuhan,China / Zhejiang-Hangzhou
3mo
Conducts industry research and architecture design for FPGA/ASIC hardware systems, focusing on processor, memory, wireless, and AI innovations.
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Principal Engineer – GPU Architect
MediaTek
Cambourne
3mo
Define and develop best-in-class GPU architecture and performance/power models for next-generation MediaTek SoCs, serving flagship mobile devices and adjacent markets like laptop, IoT, AI, VR/AR, and automotive.
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逻辑工程师
Sicarrier
China / Guangdong-Shenzhen,China / Shanghai-Shanghai,China / Hubei-Wuhan,China / Zhejiang-Hangzhou
3mo
Conducting industry research on FPGA/ASIC technologies, designing hardware architectures, and developing RTL code for large-scale hardware systems.
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SoC Machine Learning Design Engineer
Apple
Austin, United States of America
3mo
Designing machine learning solutions to optimize efficiency, quality, and speed for Apple's SoC chip design process, specifically in RTL Design, Verification, and Power/Performance/Area efforts.
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Modelling Lead (SystemC / Virtual-Platform Architect)
Lumilens
San Jose
3mo
Build executable SystemC/TLM-2.0 virtual platforms and architecture models for pre-silicon firmware bring-up and design-space exploration for photonic AI supercomputing engines.
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Senior Quantum Engineer - Digital Control Systems
Microsoft
United States, Washington, Redmond
3mo
Design and implement digital control subsystems interfacing with cryogenic hardware and ASICs for real-time control and feedback of quantum systems.
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HPC CPU Subsystem Engineering Manager
Renesas-Electronics
Kodaira, jp
3mo
Leading the design and development of the CPU subsystem within automotive SoCs (R-Car series), managing technical strategy and global team operations.
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HPC High-Speed I/F Engineering Manager
Renesas-Electronics
Kodaira, jp
3mo
Leading the design and development of high-speed interface subsystems within automotive SoCs (R-Car series), managing global teams and technical strategy.
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ASIC Design Engineer
Hpe
Bengaluru, Karnātaka, India
3mo
Define and architect high-performance blocks for next-generation networking ASICs, optimizing throughput and power efficiency.
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Director, HBM RTL Design and Integration
Micron
Richardson, Texas, United States of America
$177k–$177k
3mo
Lead a team in the design, integration, and delivery of next-generation HBM SoC logic die, focusing on RTL development and IP integration for AI/ML and high-performance computing systems.
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Physical Design engineer
Nxp
Noida
3mo
Define and develop Physical Design methodology for mixed-signal SoC and IP on low geometry nodes (5/14/16/28/40nm), ensuring timing, power, and signal integrity closure.
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Digital Design Engineer
Accenture
Bengaluru
3mo
Design and implement digital circuits and systems, focusing on logic, timing, and power optimization.
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Senior RTL Engineer, Interconnect Design
OpenAI
San Francisco
3mo
Designing and delivering critical on- and off-chip interconnect components (NoC, switches, routers, protocol bridges) for custom AI accelerator platforms to power frontier models.
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Principal Design Engineer
Cadence
PUNE 04
3mo
Leading physical design, timing closure, and verification for complex IP and SoC designs below 7nm.
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Director, HBM RTL Design and Integration
Micron
Richardson, TX, US
$177k–$177k
3mo
Lead a team in the design, integration, and delivery of next-generation HBM SoC logic die, focusing on RTL development and IP integration for AI/ML and high-performance computing systems.
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ASIC DV Engineer
Hpe
Bengaluru, Karnātaka, India
3mo
Lead project teams of Electronic and VLSI engineers and partners to manage all stages of VLSI design, validation, and testing for complex products and platforms.
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FPGA Compiler (Placer) Engineer
Altera
San Jose, California, United States
$149k–$149k
3mo
Developing and optimizing FPGA placement algorithms within the compiler toolchain to improve timing, congestion, and resource utilization for complex designs.
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Electrical / Hardware Engineer
Hpe
Singapore, Central Singapore, Singapore
3mo
Design and develop advanced high-speed digital hardware platforms for next-generation networking solutions, from component selection to board bring-up and validation.
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Director, Custom HBM Design and Architecture
Micron
2 Locations
$199k–$199k
3mo
Lead a team in designing, integrating, and delivering next-generation HBM SoC logic die for AI/ML applications.
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