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Hardware & Physical Engineering
› Analog IC Design
Analog IC Design
1,491 open positions
Platform Hardware Design Engineer
Intel
US, Oregon, Hillsboro
$164k–$232k
12d
End-to-end development of platform hardware, translating system requirements into circuit and component-level specifications.
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FY27 Intern - Physical Mixed Layout Engineering Internship - Canada (16 months)
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Qualcomm
Toronto, ON, CA
12d
Intern role focused on physical mixed-signal layout design for complex integrated circuits within the chip design process.
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FY27 Intern - Analog Design Internship - Canada (12 or 16 months)
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Qualcomm
Toronto, ON, CA
12d
Support the Qualcomm Analog Design team in building and validating analog circuits for next-generation connectivity and computing solutions.
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Applications Engineering, Staff Engineer (Simulation)
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Synopsys
SG
12d
Staff Applications Engineer specializing in high-frequency simulation tools (Ansys HFSS, SIwave, Q3D) to support customer technical discovery, product demonstrations, and solution delivery for signal and power integrity.
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#Hardware Design Engineer
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Qualcomm
San Diego, CA, US
$100k–$100k
12d
Develop next-generation 6G prototype platforms and high-performance hardware modules by taking high-speed digital designs from schematic architecture through physical PCB layout and lab testing.
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Layout/Mask Designer
Apple
Cupertino, United States of America
$149k–$149k
12d
Design complex circuit layouts for mixed-signal and analog circuits in deep sub-micron CMOS technologies.
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板级先进工艺设计工程师
Huawei
Dongguan, China
12d
Design end-to-end board-level assembly and reliability solutions for high-density computing products, focusing on large chip assembly, warpage control, and mixed-module integration.
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Digital Circuit Design Engineer
Apple
Cupertino, United States of America
$149k–$149k
12d
Design custom circuits to improve chip power efficiency and integrate new ideas for functional products.
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Hardware Engineer
Intel
US, California, Santa Clara
$122k–$122k
12d
Design and manufacture optical transceiver modules and evaluation boards for high-speed data transmission products.
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Lead Principal Engineer Analog Design
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Infineon Technologies
Morrisville, NC, US
$192k–$192k
12d
Lead a small team of IC Design Engineers to develop high-voltage power management ICs, focusing on DC-DC control loops, gate drivers, and system integration.
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Trainee Program – Mixed-Signal IC Design for RF integrated circuits (RFIC) (all genders)
Erlangen, BAYERN
12d
Trainee role focused on learning mixed-signal IC design within an RFIC environment, collaborating on real projects under expert guidance.
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计算信号完整性工程师
Huawei
Hangzhou, China
12d
Designing and optimizing high-speed signal integrity (SI) for AI and general-purpose server computing products, focusing on 224G+ bus systems and full-link performance.
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Layout/Mask Designer
Apple
Austin, United States of America
12d
Design complex custom layouts for digital circuits in deep SubMicron CMOS technologies, ensuring robust physical design and optimal PPA.
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Stage ingénieur : mmW IC Designer Conception d'un amplificateur de puissance RF pour radar automobile évolutif (F/H)
Nxp
Grenoble
12d
Design a Power Amplifier (PA) demonstrator and benchmark CMOS vs. BiCMOS technologies for next-generation automotive radar transmit chains.
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Memory Layout Manager
Intel
India, Bangalore
12d
Lead a team of layout engineers to deliver best-in-class SRAM, RF, ROM, and CAM memory compiler designs on Intel's FinFET and GAA technologies.
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Senior Staff Engineer, Layout Design (Power & Analog ICs)
Renesas-Electronics
Bengaluru, KA, in
13d
Senior individual-contributor responsible for translating circuit requirements into robust, manufacturable layouts for power and analog IC products (PMICs, regulators, gate drivers, BMS).
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Silicon, Hardware, & Photonics Engineering - Internship
Lightmatter
Boston, MA
$83k–$83k
13d
Intern role supporting the design, simulation, testing, and integration of silicon photonics engines and photonic interconnects for AI data centers.
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Principal Mixed-Signal Design Engineer, Data Converters
K2spacecorporation
United States - Remote
$190k–$190k
13d
Lead architecture and development of wideband, high-performance data converters and associated analog front-ends for advanced mixed-signal SoCs in high-power satellite platforms.
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Senior ASIC Package Design Engineer
K2spacecorporation
Seattle
$180k–$180k
13d
Designing advanced ASIC package architecture for high-performance mixed-signal and digital SoCs, focusing on flip-chip BGA and multi-chip module solutions for high-power satellites.
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Senior ASIC Package Design Engineer
K2spacecorporation
United States - Remote
$180k–$180k
13d
Design advanced ASIC package architecture for high-performance mixed-signal and digital SoCs, focusing on flip-chip BGA and multi-chip module solutions for high-power satellites.
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Senior Engineer, Analog Design Engineering
Analogdevices
Taiwan, Taipei, Songgao
13d
Designing transistor-level analog/mixed-signal circuits and validating performance in the lab for consumer IC products.
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Principal Advanced Packaging Design Engineer
Marvell
Burlington, VT
$168k–$249k
13d
Lead package design and technology development for next-generation HPC, AI, and networking solutions, focusing on signal, power, thermal, and mechanical integrity of multi-chip configurations.
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Senior Analog Layout Designer
Olix
Austin, TX
13d
Create layouts for RX/TX lane macros and support lane-level integration for high-performance decode accelerators.
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Signal Integrity Engineer – Memory Interface
Apple
San Francisco Bay Area, United States of America
13d
Signal integrity and power integrity engineering for Apple SoC memory interfaces (DDR/LPDDR) from package to board.
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Engineer, Semi Packaging Engineering
Analogdevices
US, MA, Wilmington
$75k–$75k
13d
Lead the design, development, and qualification of advanced semiconductor packaging solutions (wire-bond, flip-chip, SiP, modules) balancing reliability, manufacturability, and cost.
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Senior SoC Physical Layout & Full-Chip Integration Engineer
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Intel Corporation
Hillsboro, OR, US
$122k–$232k
13d
Lead full-chip floorplanning, physical integration, and tapeout for advanced-node silicon development vehicles.
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Senior Analog IC Design Engineer
ON Semiconductor
Marin-Epagnier, Neuchatel, Switzerland
13d
Design and develop precision analog/mixed-signal IP components for automotive, industrial, and medical products.
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SerDes Micro Architect
Apple
Waltham, United States of America
13d
Define micro architecture for analog mixed-signal SERDES IPs to enable high power and performance in Apple silicon devices.
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Analog Circuit Design Engineer
Intel
India, Bangalore
13d
Lead the design and development of advanced analog and mixed-signal circuits for high-speed chip-to-chip and package-to-package connectivity.
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Sr. Principal Engineer: Silicon Photonics-Hybrid Integration
Lumentum
USA - CA - San Jose (Ridder)
$150k–$150k
13d
Lead the development of high-volume process flows for hybrid integration of unique materials to enhance Silicon photonics performance for cloud and network applications.
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Senior Analog Design Engineer
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Intel Corporation
Santa Clara, CA, US
$142k–$142k
13d
Design and validate high-speed analog and mixed-signal integrated circuits for silicon photonics optical interconnect products.
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SerDes Micro Architect
Apple
Austin, United States of America
13d
Define micro architecture for next-generation SERDES IPs used in Apple silicon for iPhone, iPad, Mac, and Apple Watch.
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Signal Integrity Engineer – Memory Interface
Apple
Austin, United States of America
13d
Ensuring signal and power integrity for memory interfaces in Apple SoCs from package to board level.
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Senior Analog Design Engineer
Intel
US, California, Santa Clara
$142k–$142k
13d
Design and validate high-speed analog and mixed-signal integrated circuits for silicon photonics optical interconnect products.
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Senior Staff ESD Engineer
Renesas-Electronics
Chandler, Arizona, us
13d
Design and optimize ESD protection structures and perform characterization for High Voltage BCD, analog, power, and mixed-signal ICs to ensure robust protection in automotive and industrial applications.
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Staff Analog Engineer
Renesas-Electronics
Kodaira, jp
14d
Design and verify functional high-side switch analog product lines including LDOs, Bandgaps, Charge pumps, Predrivers, Power FETs, and ADCs for new product development.
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Team leader - RF/Analog Analysis & Characterization
Renesas-Electronics
Athens, gr
14d
Lead a team in Pre/Post silicon activities for RF, Analog, and PHY system circuit building blocks to meet functional and performance specifications.
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Mixed Signal Design Engineer
Nxp
Tianjin (Teda)
14d
Design, implement, and verify analog/mixed-signal IP blocks while defining architecture with digital and SOC teams.
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Associate Analog Design Engineer
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Analog Devices
Toronto, ON, CA
14d
Design and development of analog and mixed-signal integrated circuits including sensor interfaces, data converters, and power distribution systems.
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ENGR STAFF, R&D ENGINEERING; DSGN (SIMULATION ENGINEER)
ON Semiconductor
Seremban, Negeri Sembilan, Malaysia
14d
Develop and execute thermo-mechanical simulation methodologies for semiconductor packages and power modules to support new product development and design optimization.
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Principal Foundry Interface Design Engineer, HBM
Micron
Folsom, CA, US
$150k–$150k
14d
Serve as the primary technical interface between Micron design teams and foundry partners to translate advanced process capabilities into scalable, high-performance HBM DRAM architectures for AI/ML workloads.
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Associate Analog Design Engineer
Analogdevices
US, AZ, Chandler, East Elliot
$68k–$68k
14d
Design and development of analog and mixed-signal integrated circuits including sensor interfaces, data converters, and power distribution systems.
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Package Development Engineer
ON Semiconductor
Scottsdale, AZ, United States
14d
Lead the development and commercialization of advanced embedded packaging technologies incorporating embedded passives, active devices, and high-density substrate integration.
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Memory Design Engineer
Broadcom
IND-Bangalore Electronic City - S1
14d
Design and development of Single/Multiport SRAM and Register file compilers across 28nm to 5FF technologies.
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Principal Mixed-Signal Design Engineer, Data Converters
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K2 Space
Los Angeles, CA, US
$190k–$190k
14d
Lead architecture and development of wideband, high-performance data converters and associated analog front-ends for advanced mixed-signal SoCs.
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Principal Engineer - HIG HBM - ARCHITECTURE
Micron
Richardson, TX
14d
Define and drive the architecture of high-speed analog and mixed-signal IO subsystems for next-generation High Bandwidth Memory (HBM) products used in AI and high-performance computing.
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ESD Design Expert
Nxp
Toulouse
14d
Define and deploy advanced ESD protection solutions and strategies for automotive and industrial semiconductor products, ensuring robustness and First-Pass-Right development.
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Analog Electronics Design Engineer (m/f/d) - DELFT
Amat
Nijmegen,NLD
14d
Designing, modifying, and troubleshooting high-precision, low-noise analog and power circuit assemblies for electron beam-based wafer test systems.
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Principal Advanced Packaging Engineer
Asteralabs
Taiwan
15d
Lead R&D for next-generation packaging technologies for optical chips (NPO and CPO products), setting technical direction and driving development of 2.1D, 2.5D, and 3D integration.
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Senior Staff Electro-Optic Systems Architect
Lightmatter
Boston, MA
15d
Design and develop innovative photonics architecture solutions for high-volume AI data center products, ensuring electrical-optical-electrical links meet customer requirements.
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