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Hardware & Physical Engineering
› ASIC Physical Design
ASIC Physical Design
1,645 open positions
Digital IC Design/Verification Engineer
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Marvell Technology
Cordoba, Córdoba, Argentina
1mo
Implementing digital logic blocks for high-speed coherent transceivers in PCIe systems, including RTL design, verification, and automated test case development.
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FPGA Developer (f/m/x)
Zeissgroup
Oberkochen
1mo
Design and implement FPGA-based digital logic, develop custom IP cores, and optimize designs for timing, power, and performance.
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DSP Firmware Engineer
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Marvell Technology
Cordoba, Córdoba, Argentina
1mo
Design, simulate, implement, and validate RTL for microcontroller subsystems and on-chip interfaces within high-performance coherent DSP ASICs for fiber optical networks.
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Principal Engineer - Digital Design
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Microchip Technology Inc.
Cork, County Cork, Ireland
1mo
Designing high-performance multi-gigabit T1 Ethernet PHYs and digital blocks for automotive and industrial networking ICs.
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Interconnect Design Engineer
SiFive
4 Locations
$140k–$140k
1mo
Designing industry-leading CPU and interconnect IP (TileLink, cache controllers, protocol bridges) as highly-configurable generators using Chisel/Scala to accelerate RISC-V SOC adoption.
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Principal HW System Architect (f/m/d)
Renesas-Electronics
's-Hertogenbosch, NB, nl
1mo
Translate customer and standardization requirements into state-of-the-art SoC architectures and detailed target specifications for connectivity chips.
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Concepteur Digital Design (H/F/N)
Bosch-Group
Valbonne, Provence-Alpes-Côte d'Azur, fr
1mo
Digital design engineer developing SoC/ASIC subsystems and IP for automotive applications.
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Digital Design Engineer I
Silabs
Austin
$79k–$79k
1mo
Design and develop digital components and SoC architectures for wireless microcontroller products.
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SoC Power Analysis and Optimization Engineer
Apple
Beaverton, United States of America
1mo
Drive SOC power simulation, optimization, and modeling to improve power efficiency and provide projections for future projects.
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Senior Engineer
Broadcom
IND-Bangalore Electronic City - S1, IN
1mo
Senior IC physical design engineer responsible for block-level floor-planning, partitioning, placement, clock tree synthesis, routing, and physical verification to meet congestion, timing, and area metrics.
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Mid-level Physical Design Engineer CPU
Intel
US, Oregon, Hillsboro
$122k–$122k
1mo
Execute physical design implementation for CPU core blocks or subsystems within the RTL-to-GDS flow, contributing to high-performance, power-efficient silicon.
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ASIC/SOC DFT Engineer (Silicon Engineering)
SpaceX
Austin - 800
1mo
Developing cutting-edge next-generation ASICs for deployment in space and ground infrastructures to enable global connectivity.
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ASIC/SOC DFT Engineer (Silicon Engineering)
SpaceX
Austin - 800
$0k–$0k
1mo
Developing next-generation ASICs for deployment in space and ground infrastructures to enable global connectivity via the Starlink network.
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Principal Electrical Engineer
Renesas-Electronics
Palm Bay, Flordia , us
1mo
Architecting and verifying mixed-signal digital circuits and algorithms for radiation-hardened integrated solutions.
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Senior PD Engineer: Synthesis & STA
Enchargeai36
Remote
1mo
End-to-end ownership of logic synthesis and quality signoff for key blocks and sub-chips, acting as a bridge between front-end design and back-end physical implementation teams.
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Technical Program Manager, Silicon
Anthropic
San Francisco, CA
$365k–$365k
1mo
End-to-end execution of custom silicon development for Claude AI models, from architecture definition through tapeout and production ramp.
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Director- R&D Technical Head
Semtech
IND - Hyderabad
1mo
Define and own end-to-end chip design strategy, methodology, and technology roadmap across SoC, Analog, Digital, Product & Test Engineering, Design Packaging, Verification, and DFT verticals.
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Design Engineer
Apple
Herzliya, Israel
1mo
Develop multiple IPs for Apple SoCs in Storage, Computer Vision, and RISC-V CPU domains, handling micro-architecture definitions, RTL coding, block-level simulations, and synthesis.
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Hardware Systems Engineer - Board Design
Apple
Cupertino, United States of America
1mo
Design and manufacture high-performance, power-efficient system-on-chip (SoC) processors for Apple devices.
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STAFF ASIC Design Engineer
Micron
Hsinchu - Chang Yih, Taiwan
1mo
Design, implement, and debug complex logic for next-generation solid-state drive controllers, covering RTL development, integration, and validation from concept to production silicon.
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Timing Engineer
Altera
San Jose, California, United States
$119k–$119k
1mo
Lead timing activities for FPGA subsystems, achieving timing convergence from implementation through final sign-off.
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Host and Network IO FPGA Engineer
Cerebras
Headquarters/Sunnyvale Office
1mo
Design and implement the full in-chassis IO subsystem for Cerebras' AI chip, connecting distributed server nodes via custom RoCE v2 networks to the WSE.
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Senior Manager, ASIC Chip Engineering
NVIDIA
US, CA, Santa Clara
$232k–$232k
1mo
Drive development of future SoC processors for client, workstation, embedded, and automotive markets from concept to production.
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SRAM Compiler Circuit Designer
Apple
Munich, Germany
1mo
Designing high-performance, low-power SRAM, register files, and latch arrays for Apple silicon processors.
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Staff RTL Design Engineer
SiFive
Hsinchu, Taiwan
1mo
Architect, design, and implement new features, performance improvements, and ISA extensions in RISC-V CPU core generators.
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Principal Engineer- Digital Design
Renesas-Electronics
Bengaluru, KA, in
1mo
Lead micro-architecture, design, and execution of next-generation UA Link Switch solutions for high-bandwidth, low-latency connectivity in AI, HPC, and memory-centric systems.
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Hardware Engineer (Enterprise Switch)
Ubiquiti
Taipei
1mo
Lead hardware circuit design, schematic capture, and layout review for next-generation, high-density, and high-throughput networking platforms.
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Silicon Engineer
Anthropic
San Francisco, CA
$320k–$320k
1mo
Designing custom silicon chips for Anthropic's large-scale AI training and inference workloads, covering domains from front-end design to packaging and signal integrity.
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Director, Physical Design (Silicon One)
Cisco
San Jose, California, US
$251k–$251k
1mo
Lead the physical design implementation of complex SoCs for Cisco's Silicon One architecture, optimizing PPA goals and managing execution schedules for advanced process nodes.
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Senior Staff Hardware Engineer
Marvell
Taipei
1mo
Design high-performance board-level systems for storage, network security, and custom ASIC applications, managing designs with JDM partners to ensure production quality.
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Senior Front-End Power Engineer
NVIDIA
2 Locations
1mo
Analyze full chip and unit-level power data to drive ASIC teams in improving power efficiency for NVIDIA Switches.
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Physical Design Engineer Intern
Monolithicpower
Barcelona, Spain
1mo
Assist in the development, design, and physical implementation of digital and mixed-signal ICs utilizing leading edge technologies.
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Physical Design Methodology Engineer, AI HW IP
Tenstorrent
Austin
$100k–$100k
1mo
Develops, deploys, and owns the RTL-to-GDSII methodology for AI hardware IP physical design teams to ensure new blocks start from a working flow.
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SoC Architect
Waymo
Mountain View (US-MTV-EMF690)
$251k–$251k
1mo
Architect and create high-performance custom silicon and system-level compute architectures for Waymo's fully autonomous vehicle software stack.
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Senior FPGA Engineer, Cyber
Andurilindustries
Washington, DC (999)
$166k–$166k
1mo
Design and implement high-throughput FPGA datapaths, packetization pipelines, timing-sensitive interfaces, and hardware-near acceleration blocks for offensive cyber missions.
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Principal AI Silicon Architect
Microsoft
United States, California, Mountain View
1mo
Define high-performance silicon architecture specifications for AI accelerators and guide end-to-end silicon development cycles.
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Physical Design Engineer
Axiado
Hyderabad, TS, in
1mo
Backend implementation engineer responsible for floorplanning, placement, CTS, routing, timing closure, and physical signoff for ASIC chips.
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Senior / Lead Physical Design Engineer
Axiado
Hyderabad, TS, in
1mo
Lead backend implementation, signoff quality, and methodology development for ASIC programs from RTL handoff through tapeout.
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Principal Engineer PD
Asteralabs
Singapore City
1mo
Senior Physical Design Engineer developing next-generation transceiver IPs for high-speed connectivity in advanced technology nodes.
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ASIC TOP Floorplan Design Engineer
NVIDIA
China, Shanghai
1mo
Design and optimize floorplans for next-generation GPUs and SoCs, influencing early design decisions to solve timing, routing congestion, and area issues.
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ASIC Design Engineer
Apple
Cupertino, United States of America
1mo
Architecting power management solutions and designing complex logic for System-on-Chip (SoC) integration.
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Senior Hardware Engineer
NVIDIA
Israel, Raanana
1mo
Lead system and board design for GPU networking infrastructure (NVLINK) enabling high-bandwidth connectivity for next-generation AI and data center servers.
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2027校招 - 数字IC设计工程师 / Digital Design Engineer
Texas Instruments
Shanghai, China
1mo
Architect new TI products by defining, designing, modeling, and verifying digital circuits including 64-bit DSP processors, MMUs, and heterogeneous multicore shared memory/cache systems.
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Principal SoC Chip Lead
Nxp
Shanghai (Pudong), CN
1mo
Own SoC program execution from project definition through tape-out and post-silicon support, ensuring on-time delivery and coordinating engineering support during silicon bring-up and validation.
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MTS, AI Optimized Memory Digital Design Engineer
Micron
Folsom, CA, US
$175k–$175k
1mo
Design and implement high-performance, silicon-proven memory architectures for AI workloads, translating architectural vision into efficient hardware.
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Principal Engineer, High‑Speed RTL Design
Micron
Bengaluru, India
1mo
Design and implement timing-critical high-speed RTL blocks for memory and storage solutions, ensuring robust logic for synthesis and timing closure.
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Core Performance Architect
SiFive
Santa Clara, California, United States
$179k–$179k
1mo
Research and develop next-generation high-performance processors and micro-architectures to meet aggressive performance targets.
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Senior Staff / Principal SOC Floorplan Lead
Enchargeai36
India
1mo
Own the physical foundation of next-generation AI and Data Center SoCs, bridging architecture, logic design, and physical design to achieve best-in-class Power, Performance, and Area (PPA).
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Hardware Engineer (FPGA/ASIC)
Janestreet
London
1mo
Intern role focused on using programming language technology (OCaml/Hardcaml) to improve the design, testing, and validation of hardware designs.
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Digital Design Engineer – AI Accelerators
Stmicroelectronics
Greater Noida, India
1mo
Design and implement high-throughput compute datapaths and microarchitectures for AI accelerator chips, integrating compute blocks with memory interfaces.
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